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EVALUATION ON ELECTROMIGRATION AND STRESSMIGRATION OF METAL INTERCONNECTIONS BY HARDNESS MEASUREMENTS

著者名:
Nakagawa, T.
Miyatake, H.
Maeda, T.
Kuroda, K.
Tokushige, N.
Inoue, R.
Kudo, J.
Ashida, T.
さらに 3 件
掲載資料名:
Mechanical behavior of materials and structures in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
226
発行年:
1991
開始ページ:
425
終了ページ:
432
総ページ数:
8
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991200 [1558991204]
言語:
英語
請求記号:
M23500/226
資料種別:
国際会議録

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