*A DAMAGE INTEGRAL APPROACH TO SOLDER JOINT FATIGUE

*A DAMAGE INTEGRAL APPROACH TO SOLDER JOINT FATIGUE

著者名:

掲載資料名:

Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

203

発行年:

1991

開始ページ:

395

終了ページ:

404

総ページ数:

10

出版情報:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558990951 [155899095X]

言語:

英語

請求記号:

M23500/203

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015687
シリーズID:	PA00000011
会議名:	Symposium on electronic packaging materials science
回次:	5th
会議開催地:	Boston, MA, USA
会議開催年:	1990.11.26-1990.11.29

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