PRECIPITATION OF COPPER AND COBALT AT GRAIN BOUNDARIES IN SILICON

PRECIPITATION OF COPPER AND COBALT AT GRAIN BOUNDARIES IN SILICON

著者名:

掲載資料名:

Impurities, defects, and diffusion in semiconductors : bulk and layered structures : symposium held November 27-December 1, 1989, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

163

発行年:

1990

開始ページ:

579

終了ページ:

584

総ページ数:

6

出版情報:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558990517 [1558990518]

言語:

英語

請求記号:

M23500/163

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015647
シリーズID:	PA00000011
会議名:	Symposium on impurities, defects, and diffusion in semiconductors
回次:	1989
会議開催地:	Boston, MA, USA
会議開催年:	1989.11.27-1989.12.01

類似資料:

1 国際会議録 THE PRECIPITATION OF NICKEL AND COPPER AT GRAIN BOUNDARIES IN SILICON Moller, H.J., Jendrich, U., Huang, L., Foitzik, A. Materials Research Society	7 国際会議録 CHARGED DEFECT STATES AT SILICON GRAIN BOUNDARIES. STUTZLER,F.J., TAPFER,L., QUEISSER,H.J. Trans Tech Publications
2 国際会議録 INVESTIGATION OF THE COBALT SEGREGATION AND THE STRUCTURE OF A GRAIN BOUNDARY IN SILICON' Tutken, T., Schroter, W., Moller, H.J. Materials Research Society	8 国際会議録 HREM Study of Copper Precipitation in a ｦｲ=25 Silicon Tilt Grain Boundary Elkajbaji,M., Thibault,J. Trans Tech Publications
3 国際会議録 TEM AND HREM INVESTIGATION OF THE PRECIPITATION OF COBALT AND NICKEL IN POLYCRYSTALLINE SILICON Moller, H. J., Chung, Juyong, Huang, Lan Materials Research Society	9 国際会議録 FORMATION OF MICRO-PRECIPITATES AT THE MELT-SOLID INTERFACE IN SEMICONDUCTORS Moller, H.J. Materials Research Society
4 国際会議録 A TEM INVESTIGATION OF SECONDARY DISLOCATINS IN GRAIN BOUNDARIES IN GERMANIUM Griess, M., Seibt, M., Moller, H.J. Materials Research Society	10 国際会議録 Cooperative Grain Boundary Sliding and Shear Banding at High Strains in Ultrafine Grained and Nanocrystalline Pd Alloys Y. Ivanisenko, H.J. Fecht Trans Tech Publications
5 国際会議録 Transport across silicon grain boundaries Werner, J., Jantsch, W., Froehner, K.H., Queisser, H.J. North-Holland	11 国際会議録 Nucleation of Dynamic Recrystallization at the Grain Boundaries of Copper Bicrystals H. Miura, T. Sakai, R. Mogawa, J.J. Jonas Trans Tech Publications
6 国際会議録 Precipitation of Copper Silicide at Grain Boundary in Silicon Abdelaoui,R., Nouet,G., Allais,G. Trans Tech Publications	12 国際会議録 Grain Boundary Engineering of ECAPed OFHC Copper W. Feng, J.H. Zhang, S. Yang Trans Tech Publications

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