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*CERAMICS IN MICROELECTRONICS PACKAGING: PAST, PRESENT AND FUTURE

著者名:
Tummala, Rao R.  
掲載資料名:
Electronic packaging materials science IV : symposium held April 24-28, 1989, San Diego, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
154
発行年:
1989
開始ページ:
379
終了ページ:
386
総ページ数:
8
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558990272 [1558990275]
言語:
英語
請求記号:
M23500/154
資料種別:
国際会議録

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