WAFER BONDING FOR SOI

WAFER BONDING FOR SOI

著者名:

Maszara, W. P.

掲載資料名:

Silicon-on-insulator and buried metals in semiconductors : symposium held November 30-December 3, 1987, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

107

発行年:

1988

開始ページ:

489

終了ページ:

494

総ページ数:

6

出版情報:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9780931837753 [0931837758]

言語:

英語

請求記号:

M23500/107

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015593
シリーズID:	PA00000011
会議名:	Symposium on silicon-on-insulator and buried metals in semiconductors
回次:	1987
会議開催地:	Boston, MA, USA
会議開催年:	1987.11.30-1987.12.03

類似資料:

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2 国際会議録 The floating body in SOI McKitterick, J.B. Electrochemical Society	8 国際会議録 Surface Passivation for Low-Temperature UHV Wafer Bonding of GaAs Substrates Hesse, P.J., Haas, T.W., Lampert, W.V., Eyink, K.G., Tomich, D.H., Seaford, M.L. Electrochemical Society
3 国際会議録 VISUALIZATION OF TERMPERATURE PROFILES IN a-Si CRYSTALLIZED IN THE EXPLOSIVE MODE BY CW LASER Rivier, M., Cserhati, A., Goetz, G. North-Holland	9 国際会議録 Sensor deployment planning for unattended ground sensor networks McKitterick, J. B. SPIE - The International Society of Optical Engineering
4 国際会議録 New SOI devices transferred onto fused silica by direct wafer bonding Lagahe-Blanchard, C., Aspar, B., Paillet, P., Ferlet-Cavois, V., Fel, N., Pavageau, C., du Port de Poncharra, J., … Electrochemical Society	10 国際会議録 Cyclodextrin Use in Separations Szejtli, J., Zsadon, B., Cserhati, T. American Chemical Society
5 国際会議録 Adhesive wafer bonding for MEMS applications Dragoi, V., Glinsner, T., Mittendorfer, G., Wieder, B., Lindner, P. SPIE-The International Society for Optical Engineering	11 国際会議録 Two-color HgCdTe infrared staring focal plane arrays (Invited Paper) Smith, E. P., Pham, L. T., Venzor, G. M., Norton, E., Newton, M., Goetz, P., Randall, V., Pierce, G., Patten, E. A., … SPIE - The International Society of Optical Engineering
6 国際会議録 LARGE DIAMETER SOI WAFERS BY ZONE-MELTING-RECRYSTALLIZATION Zavracky, P. M., Vu, D. P., Allen, L., Henderson, W., Guekel, H., Sniegowski, J. J., Ford, T. P, Fan, J. C. C. Materials Research Society	12 国際会議録 Silicon Wafer Direct Bonding for Smart-Cut SOI with Buried Tungsten Silicide Layer Suder, S.L., Hurley, R., Li, F.X., Bain, M., Baine, P., MeNeill, D.W., Armstrong, B.M., Gamble, H.S. Electrochemical Society

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