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DEFORMATION PROPERTIES OF A LEAD-TIN (95-5) SOLDER

著者名:
掲載資料名:
Electronic packaging materials science II : symposium held April 15-18 1986, Palo Alto, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
72
発行年:
1986
開始ページ:
175
終了ページ:
180
総ページ数:
6
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9780931837388 [0931837383]
言語:
英語
請求記号:
M23500/72
資料種別:
国際会議録

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