CMP Technology for the 32-45 nm Node Cu/Low-k Integration (Invited paper)
- 著者名:
Kondo, S. Yoon, B.U. Tokitoh, S. Namiki, A. Misawa, K. Inukai, K. Sone, S. Shin, H.J. Matsubara, Y. Ohashi, N. Kobayashi, N. - 掲載資料名:
- ULSI Process Integration : proceedings of the International Symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2005-06
- 発行年:
- 2005
- 開始ページ:
- 385
- 終了ページ:
- 394
- 総ページ数:
- 10
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774642 [1566774640]
- 言語:
- 英語
- 請求記号:
- E23400/200506
- 資料種別:
- 国際会議録
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SPIE - The International Society of Optical Engineering |
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SPIE - The International Society of Optical Engineering |
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SPIE-The International Society for Optical Engineering |
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