Recent Results on Advanced Molecular Wafer Bonding Technology for 3D Integration on Silicon
- 著者名:
di Cioccio, L. Biasse, B. Kostrzewa, M. Zussy, M. Dechamp, J. Charlet, B. Vinet, M. Fedeli, J.M. Poiroux, T. Lagahe-Blanchard, C. Aspar, B. Regreny, P. Kernevez, N. - 掲載資料名:
- Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2005-02
- 発行年:
- 2005
- 開始ページ:
- 280
- 終了ページ:
- 287
- 総ページ数:
- 8
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774604 [1566774608]
- 言語:
- 英語
- 請求記号:
- E23400/200502
- 資料種別:
- 国際会議録
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