Direct Bonding of Thick Film Polysilicon to Glass Substrates
- 著者名:
- 掲載資料名:
- Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2005-02
- 発行年:
- 2005
- 開始ページ:
- 194
- 終了ページ:
- 204
- 総ページ数:
- 11
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774604 [1566774608]
- 言語:
- 英語
- 請求記号:
- E23400/200502
- 資料種別:
- 国際会議録
類似資料:
Electrochemical Society |
Electrochemical Society |
2
国際会議録
Integration of CMP Fixed Abrasive Polishing into the Manufacturing of Thick Film SOI Substrates
Materials Research Society |
8
国際会議録
Fabrication of InP/SiO2/Si Substrate using Ion-Cuffing Process and Selective Chemical Etching
Electrochemical Society |
Electrochemical Society |
9
国際会議録
A Novel Low-Temperature LPCVD Process for Deposition of Polysilicon Films on Glass Substrates
Electrochemical Society |
Materials Research Society |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
Materials Research Society |
Materials Research Society |