Wafer Scale Packaging of MEMS by Using Plasma Activated Wafer Bonding
- 著者名:
Suni, T. Henttinen, K. Lipsainen, A. Dekker, J. Luoto, H. Kulawski, M. - 掲載資料名:
- Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2005-02
- 発行年:
- 2005
- 開始ページ:
- 173
- 終了ページ:
- 183
- 総ページ数:
- 11
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774604 [1566774608]
- 言語:
- 英語
- 請求記号:
- E23400/200502
- 資料種別:
- 国際会議録
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