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Wafer Scale Packaging of MEMS by Using Plasma Activated Wafer Bonding

著者名:
Suni, T.
Henttinen, K.
Lipsainen, A.
Dekker, J.
Luoto, H.
Kulawski, M.
さらに 1 件
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2005-02
発行年:
2005
開始ページ:
173
終了ページ:
183
総ページ数:
11
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
言語:
英語
請求記号:
E23400/200502
資料種別:
国際会議録

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