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200 mm Germanium-on-Insulator (GeOI) Structures Realized from Epitaxial Wafers using the Smart CutTM Technology

著者名:
Deguet, C.
Dechamp, J.
Morales, C.
Charvet, A.M.
Clavelier, L.
Loup V.
Hartmann, J.M.
Kernevez, N.
Campidelli, Y.
Allibert, F.
Richtarche, C.
Akatsu, T.
Letertre, F.
さらに 8 件
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2005-02
発行年:
2005
開始ページ:
78
終了ページ:
88
総ページ数:
11
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
言語:
英語
請求記号:
E23400/200502
資料種別:
国際会議録

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