The effect of film thickness on the dissolution rate and hydrogen bonding behavior of photoresist polymer thin films

The effect of film thickness on the dissolution rate and hydrogen bonding behavior of photoresist polymer thin films

著者名:

Kim, J.-B. ( Korea Advanced Institute of Science and Technology (South Korea) )
Park, J.-Y. ( Korea Advanced Institute of Science and Technology (South Korea) )

掲載資料名:

Advances in resist technology and processing XXII : 28 February-2 March, 2005, San Jose, California, USA

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

5753(1)

発行年:

2005

パート:

1

開始ページ:

319

終了ページ:

328

総ページ数:

10

出版情報:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819457332 [0819457337]

言語:

英語

請求記号:

P63600/5753-1

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014977
シリーズID:	PA00000029
会議名:	SPIE Advanced Lithography : Metrology, Inspection, and Process Control for Microlithography
回次:	2005 : 22th
会議開催地:	San Jose, CA, USA
会議開催年:	2005.02.28-2005.03.02

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