Experimental Characterization Of The Reliability Of 3-Terminal Dual-Damascene Copper Interconnect Trees

Experimental Characterization Of The Reliability Of 3-Terminal Dual-Damascene Copper Interconnect Trees

著者名:

Gan, C.L.

掲載資料名:

Silicon materials - processing characterization and reliability : symposium held April 1-5, 2002, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

716

発行年:

2002

開始ページ:

431

終了ページ:

438

総ページ数:

8

出版情報:

Warrendale: Materials Research Society

ISSN:

02729172

ISBN:

9781558996526 [1558996524]

言語:

英語

請求記号:

M23500/716

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014589
シリーズID:	PA00000011
会議名:	Symposium on silicon materials - processing characterization and reliability
回次:	2002
会議開催地:	San Francisco, CA, USA
会議開催年:	2002.04.01-2002.04.05

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