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Effect of pH on Chemical-Mechanical Polishing of Copper and Tantalum

著者名:
掲載資料名:
Chemical-mechanical polishing 2001 -- advances and future challenges : symposium held April 18-20, 2001, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
671
発行年:
2001
総ページ数:
6
出版情報:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558996076 [1558996079]
言語:
英語
請求記号:
M23500/671
資料種別:
国際会議録

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