Slurry Retention and Transport During Chemical-Mechanical Polishing of Copper
- 著者名:
- 掲載資料名:
- Chemical-mechanical polishing 2001 -- advances and future challenges : symposium held April 18-20, 2001, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 671
- 発行年:
- 2001
- 総ページ数:
- 6
- 出版情報:
- Warrendale, PA: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558996076 [1558996079]
- 言語:
- 英語
- 請求記号:
- M23500/671
- 資料種別:
- 国際会議録
類似資料:
Materials Research Society |
Electrochemical Society |
Electrochemical Society |
American Institute of Chemical Engineers |
MRS - Materials Research Society |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
Materials Research Society |
Materials Research Society |
Electrochemical Society |
MRS - Materials Research Society |