The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP
- 著者名:
Song, Jae-Hoon Han, Ja-Hyung Hong, Yi-Koan Kang, Young-Jae Park, Jin-Goo Maeng, Ju-Ho Won, Young-Man - 掲載資料名:
- Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 867
- 発行年:
- 2005
- 開始ページ:
- 35
- 終了ページ:
- 40
- 総ページ数:
- 6
- 出版情報:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558998209 [1558998209]
- 言語:
- 英語
- 請求記号:
- M23500/867
- 資料種別:
- 国際会議録
類似資料:
Materials Research Society |
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9
国際会議録
THE EFFECTS OF pH ADJUSTORS IN POST Cu CMP CLEANING SOLUTIONS ON PARTICLE ADHESION AND REMOVAL
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