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Multi-Via Electromigration Test Structures for Identification and Characterization of Different Failure Mechanisms

著者名:
Choi, Z.-S.
Chang, C.W.
Lee, J.H.
Gan, C.L.
Thompson, C.V.
Pey, K.L.
Choi, W.K.
さらに 2 件
掲載資料名:
Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
863
発行年:
2005
開始ページ:
271
終了ページ:
276
総ページ数:
6
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998162 [1558998160]
言語:
英語
請求記号:
M23500/863
資料種別:
国際会議録

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