Advances in the CMP Process on Fixed Abrasive Pads for the Polishing of SOI-Substrates With High Degree of Flatness

Advances in the CMP Process on Fixed Abrasive Pads for the Polishing of SOI-Substrates With High Degree of Flatness

著者名:

Kulawski, Martin

掲載資料名:

Advances in chemical-mechanical polishing : symposium held April 13-15, 2004, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

816

発行年:

2004

開始ページ:

191

終了ページ:

196

総ページ数:

6

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997660 [1558997660]

言語:

英語

請求記号:

M23500/816

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014458
シリーズID:	PA00000011
会議名:	Symposium on advances in chemical-mechanical polishing
回次:	2004
会議開催地:	San Francisco, CA, USA
会議開催年:	2004.04.13-2004.04.15

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5 国際会議録 Through-Wafer Polysilicon Interconnect Fabrication with In-Situ Boron Doping Luusua, Ismo, Henttinen, Kimmo, Pekko, Panu, Vehmas, Tapani, Luoto, Hannu Materials Research Society	11 国際会議録 Analysis of Frictional Heating of Grooved and Flat CMP Polishing Pads Borucki, L., Charns, L., Philipossian, A. Electrochemical Society
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