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Effect of Hydrogen Peroxide on Oxidation of Copper in CMP Slurries Containing Glycine and Cu Sulfate

著者名:
掲載資料名:
Advances in chemical-mechanical polishing : symposium held April 13-15, 2004, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
816
発行年:
2004
開始ページ:
29
終了ページ:
34
総ページ数:
6
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997660 [1558997660]
言語:
英語
請求記号:
M23500/816
資料種別:
国際会議録

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