Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects
- 著者名:
Choi, Z.-S. Gan, C.L. Wei, F. Thompson, C.V. Lee, J.H. Pey, K.L. Choi, W.K. - 掲載資料名:
- Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 812
- 発行年:
- 2004
- 開始ページ:
- 373
- 終了ページ:
- 378
- 総ページ数:
- 6
- 出版情報:
- Warrendale: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558997622 [1558997628]
- 言語:
- 英語
- 請求記号:
- M23500/812
- 資料種別:
- 国際会議録
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