Strained Silicon on Insulator Wafers Made by the Smart CutTM Technology

Strained Silicon on Insulator Wafers Made by the Smart CutTM Technology

著者名:

掲載資料名:

High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

809

発行年:

2004

開始ページ:

83

終了ページ:

88

総ページ数:

6

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997592 [1558997598]

言語:

英語

請求記号:

M23500/809

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014451
シリーズID:	PA00000011
会議名:	Symposium on high-mobility group
回次:	4th
会議開催地:	San Francisco, CA, USA
会議開催年:	2004.04.13-2004.04.15

類似資料:

1 国際会議録 Smart Cut Technology: the path for advanced SOI substrates Moriceau, H., Lagahe-Blanchard, C., Fournel, F., Pocas, S., Jalaguier, E., Perreau, P., Deguet, C., Ernst, T., Beaumont, … Kluwer Academic Publishers	7 国際会議録 200 mm Germanium-on-Insulator (GeOI) Structures Realized from Epitaxial Wafers using the Smart CutTM Technology Deguet, C., Dechamp, J., Morales, C., Charvet, A.M., Clavelier, L., Loup V., Hartmann, J.M., Kernevez, N., Campidelli, … Electrochemical Society
2 国際会議録 Germanium-on-Insulator (GeOI) Structure Realized by the Smart CutTM Technology Letertre, F., Deguet, C., Richtarch, C., Faure, B., Hartmann, J.M., Chieu, F., Beaumont, A., Dechamp, J., Morales, C., … Materials Research Society	8 国際会議録 (9.4) 11:40 - 12:00 PM - High Ge Content Si/SiGe Heterostructures for Microelectronics and Optoelectronics Purposes Bogumilowicz, Y., Hartmann, J.M., Damlencourt, J.F., Vandelle, B., Abbadie, A., Papon, A.-M., Rolland, G., Holliger, P., … Electrochemical Society
3 国際会議録 On the mechanism of the Smart CutTM layer transfer in relaxed SiGe Nguyen, P., Aulnette, C., Guiot, E., Daval, N., Bourdelle K.K., Cayrefourcq, I., Deguet, C., Sartori, S., Tauzin, A., … Electrochemical Society	9 国際会議録 Stress Metrology : The Challenge for the Next Generation of Engineered Wafers Tiberi, Antoine, Paillard, Vincent, Aulnette, Cecile, Daval, Nicolas, Bourdelle, Konstantin K., Moreau, Myriam, Kennard, … Materials Research Society
4 国際会議録 Overview on Some Recent Advances in Wafer Bonding Technologies Moriceau, H., Fournel, F., Rayssac, O., Cartier, A.M., Morales, C., Pocas, S., Zussy, M., Jalaguier, E., Biasse, B., … Electrochemical Society	10 国際会議録 Transfer of Two-Inch GaN Film by the Smart CutTM Technology Tauzin, A., Akatsu, T., Rabarot, M., Dechamp, J., Zussy, M., Moriceau, H., Michaud, J.F., Charvet, A.M., Di Cioccio, L., … Electrochemical Society
5 国際会議録 Wet-Cleaning and Surface Characterization of Si₁₋xGex Relaxed Alloys (x=0.2-0.5) After Polishing: Applications for SGOI and Strained Silicon Structures … A. Abbadie, J. M. Hartmann, P. Besson, D. Rouchon, P. Holliger, C. Di Nardo, T. Lardin, Y. Campidelli, B. Ghyselen, T. … Electrochemical Society	11 国際会議録 (7.3) 2:50 - 3:20 PM - Photonics, Electronics, and Silicon-Germanium: A Possible Convergence? (Invited) Kermarrec, O., Campidelli, Y., Bensahel, D. (STMicroelectronics) Electrochemical Society
6 国際会議録 (19.3) 1:50 - 2:10 PM - Understanding and Improvement of the SiGe Wet Selective Etch for the sSOI Manufacturing by the Smart Cut Process Rayssac, O., Besson, P., Loup, V., Aulnette, C., Favier, S., Osternaud, B., Portigliatti, L., Cayrefourcq, I. (SOITEC) Electrochemical Society	12 国際会議録 nnovative Substrate Solutions for Wide Band Gap Materials: the Smart CutTM Approach Letertre, F., Daval, N., Templier, F., DiCioccic, L., Richtarch, C., Faure, B., Cartier, A.M., Matko, I. Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12