Blank Cover Image

Characterization and Modeling of Wafer and Die Level Uniformity in Deep Reactive Ion Etching (DRIE)

著者名:
掲載資料名:
Micro- and nanosystems : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
782
発行年:
2004
開始ページ:
435
終了ページ:
440
総ページ数:
6
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997202 [1558997202]
言語:
英語
請求記号:
M23500/782
資料種別:
国際会議録

類似資料:

1 国際会議録 Uniformity-improving dummy structures for deep reactive ion etching (DRIE) processes

Jensen, S., Jensen, J.M., Quaade, U.J., Hansen, O.

SPIE - The International Society of Optical Engineering
7 国際会議録 Microstructures for Monitoring Wafer Uniformity of Reactive Ion Etching

Leung, R., Howard, D.W., Collins, S.D., Smith, R.L.

Electrochemical Society
2 国際会議録 A novel integrated MEMS process using fluorocarbon films deposited with a deep reactive ion etching (DRIE) tool

Ayon, A. A., Chen, D-Z., Khanna, R., Braff, R., Sawin, H. H., Schmidt, M. A.

MRS-Materials Research Society
8 国際会議録 Deep Reactive Ion Etching (DRIE) of High Aspect Ratio SiC Microstructures Using a Time-Multiplexed Etch-Passivate Process

Evans, L.J., Beheim, G.M.

Trans Tech Publications
3 国際会議録 Microfabrication of Membrane-Based Devices by Deep-Reactive Ion Etching (DRIE) of Silicon

Manginell, Ronald P., Frye-Mason, Gregory C., Kent Schubert, W., Schul, Randy J., Willison, Christi G.

Electrochemical Society
9 国際会議録 DEEP LEVELS INDUCED BY SiCl4 REACTIVE ION ETCHING IN GaAs

Johnson, N. P., Foad, M. A., Murad, S., Holland, M. C., Wilkinson, C. D. W.

MRS - Materials Research Society
4 国際会議録 Optical Studies in a Deep Reactive Ion Etching (DRIE) System

S.P. Koirala, I.U. Abhulimen, M.H. Gordon, H. Abu-Safe, S.L. Burkett

Society of Vacuum Coaters
10 国際会議録 Characterization of the microloading effect in deep reactive ion etching of silicon

Jensen, S., Hansen, O.

SPIE - The International Society of Optical Engineering
5 国際会議録 High-power optical microswitch fabricated by deep reactive ion etching (DRIE)

Cochran, K.R., Fan, L., DeVoe, D.L.

SPIE-The International Society for Optical Engineering
11 国際会議録 Characterization of low temperature, wafer-level gold-gold thermocompression bonds

Tsau, Christine H., Schmidt, Martin A., Spearing, S. Mark

MRS-Materials Research Society
6 国際会議録 Deep Reactive Ion Etching of Silicon

Ayon, A.A., Chen, K-S., Lohner, K.A., Spearing, S.M., Sawin, H.H., Schmidt, M.A.

Materials Research Society
12 国際会議録 Modeling of the comb actuator deformed by microloading effect in deep reactive ion etching

Lee,J.-Y., Kim,S.-H., Lim,H.-T., Kim,C.-H., Kim,Y.-K.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12