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Selectivity Studies on Tantalum Barrier Layer in Copper CMP

著者名:
掲載資料名:
Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
767
発行年:
2003
開始ページ:
251
終了ページ:
256
総ページ数:
6
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997042 [1558997040]
言語:
英語
請求記号:
M23500/767
資料種別:
国際会議録

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