Smart Cut Technology: the path for advanced SOI substrates | 東京工業大学附属図書館文献データベース

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Smart Cut Technology: the path for advanced SOI substrates

著者名:

Lagahe-Blanchard, C.

さらに 13 件

掲載資料名:

Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment

シリーズ名:

NATO science series. Series 2, Mathematics, physics and chemistry

シリーズ巻号:

185

発行年:

2005

開始ページ:

39

終了ページ:

52

総ページ数:

14

出版情報:

Dordrecht: Kluwer Academic Publishers

ISBN:

9781402030116 [1402030118]

言語:

英語

請求記号:

N17050/185

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014359
シリーズID:	PA00000025
会議名:	NATO Advanced Research Workshop on Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment
回次:	2004
会議開催地:	Kiev, Ukraine
会議開催年:	2004.04.26-2004.04.30

類似資料:

1 国際会議録 Germanium-on-Insulator (GeOI) Structure Realized by the Smart CutTM Technology Letertre, F., Deguet, C., Richtarch, C., Faure, B., Hartmann, J.M., Chieu, F., Beaumont, A., Dechamp, J., Morales, C., … Materials Research Society	7 国際会議録 Transfer of Two-Inch GaN Film by the Smart CutTM Technology Tauzin, A., Akatsu, T., Rabarot, M., Dechamp, J., Zussy, M., Moriceau, H., Michaud, J.F., Charvet, A.M., Di Cioccio, L., … Electrochemical Society
2 国際会議録 Strained Silicon on Insulator Wafers Made by the Smart CutTM Technology Ghyselen, B., Bogumilowicz, Y., Aulnette, C., Abbadie, A., Osternaud, B., Besson, P., Daval, N., Andrieu, F., … Materials Research Society	8 国際会議録 On the mechanism of the Smart CutTM layer transfer in relaxed SiGe Nguyen, P., Aulnette, C., Guiot, E., Daval, N., Bourdelle K.K., Cayrefourcq, I., Deguet, C., Sartori, S., Tauzin, A., … Electrochemical Society
3 国際会議録 The Smart-Cut Process: Status and Developments Aspar, B., Lagahe, C., Moriceau, H., Jalaguier, E., Mas, A., Rayssac, O., Biasse, Soubie; B., Bruel, M., Auberton-Hevre, … Electrochemical Society	9 国際会議録 nnovative Substrate Solutions for Wide Band Gap Materials: the Smart CutTM Approach Letertre, F., Daval, N., Templier, F., DiCioccic, L., Richtarch, C., Faure, B., Cartier, A.M., Matko, I. Electrochemical Society
4 国際会議録 Overview on Some Recent Advances in Wafer Bonding Technologies Moriceau, H., Fournel, F., Rayssac, O., Cartier, A.M., Morales, C., Pocas, S., Zussy, M., Jalaguier, E., Biasse, B., … Electrochemical Society	10 国際会議録 AlGaN / GaN HEMT Structures Grown on SiCOI Wafers Obtained by the Smart CutTM Technology Larheche, H., Faure, B., Richtarch, C., Letertre, F., Langer, R., Bove, P. Trans Tech Publications
5 国際会議録 QuaSiC Smart-Cut Substrates for SiC High Power Devices Letertre, F., Jalaguier, E., Di Cioccio, L., Templier, F., Bluet, J.M., Banc, C., Matko, I., Chenevier, B., Bano, E., … Trans Tech Publications	11 国際会議録 200 mm Germanium-on-Insulator (GeOI) Structures Realized from Epitaxial Wafers using the Smart CutTM Technology Deguet, C., Dechamp, J., Morales, C., Charvet, A.M., Clavelier, L., Loup V., Hartmann, J.M., Kernevez, N., Campidelli, … Electrochemical Society
6 国際会議録 QuaSiC Smart-Cut Substrates for SiC High Power Devices Letertre, F., Jalaguier, E., Cioccio, L. D., Templier, F., Bluet, J.M., Banc, C., Matko, I., Chenevier, B., Bano, E., … Trans Tech Publications	12 国際会議録 ALD alumina films as buried dielectric layers for SOI structures de Beaumont, C., Moriceau, H., Rayssac, O., Bresson, N., Cristoloveanu, S., Charvet, A.M. Electrochemical Society

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