The Texture Effect on Diffusion Barrier Property on TiN Films between Copper and Si Wafer

The Texture Effect on Diffusion Barrier Property on TiN Films between Copper and Si Wafer

著者名:

Sung, D. Y.

掲載資料名:

Textures of materials : ICOTOM 14 : Proceedings of the 14th International Conference on Textures of Materials, held in Leuven, Belgium, July 11-15, 2005

シリーズ名:

Materials science forum

シリーズ巻号:

495-497(2)

発行年:

2005

開始ページ:

1371

終了ページ:

1376

総ページ数:

6

出版情報:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499755 [087849975X]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014249
シリーズID:	PA00000012
会議名:	International Conference on Textures of Materials : ICOTOM
回次:	14th
会議開催地:	Leuven, Belgium
会議開催年:	2005.07.11-2005.07.15

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