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Effects of Heat Treatment on Microstructure of Sputter Deposited TiNiPd Film on Si Wafer

著者名:
掲載資料名:
PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, China
シリーズ名:
Materials science forum
シリーズ巻号:
475-479(5)
発行年:
2005
開始ページ:
3819
終了ページ:
3822
総ページ数:
4
出版情報:
Uetikon-Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499601 [0878499601]
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

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