Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer
- 著者名:
Su, J. X. Guo, D. M. Kang, R. K. Jin, Z. J. Li, X. J. Tian, Y. B. - 掲載資料名:
- Advances in Materials Manufacturing Science and Technology : selected papers from the 11th International Manufacturing Conference in China September 18th-20th, 2004, Jinan, China
- シリーズ名:
- Materials science forum
- シリーズ巻号:
- 471-472
- 発行年:
- 2004
- 開始ページ:
- 26
- 終了ページ:
- 31
- 総ページ数:
- 6
- 出版情報:
- Zurich: Trans Tech Publications
- ISSN:
- 02555476
- ISBN:
- 9780878499564 [0878499563]
- 言語:
- 英語
- 請求記号:
- M23650
- 資料種別:
- 国際会議録
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5
国際会議録
Laser-induced shock wave removal of chemical-mechanical polishing slurries from silicon wafers
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