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Fundamental Study of Iodine and Iodine Based Slurries for Copper CMP

著者名:
掲載資料名:
Chemical mechanical polishing 2000 -- fundamentals and materials issues : symposium held April 26-27, 2000, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
613
発行年:
2001
開始ページ:
E7.8
出版情報:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995215 [1558995218]
言語:
英語
請求記号:
M23500/613
資料種別:
国際会議録

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