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Properties Of TiN Thin Films Deposited By ALCVD As Barrier For Cu Metallization

著者名:
Satta, A.
Beyer, G.
Maex, K.
Elers, K.
Haukka, S.
Vantomme, A.
さらに 1 件
掲載資料名:
Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
612
発行年:
2001
開始ページ:
D6.5
出版情報:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995208 [155899520X]
言語:
英語
請求記号:
M23500/612
資料種別:
国際会議録

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