Blank Cover Image

Circuit-Level And Layout-Specific Interconnect Reliability Assessments

著者名:
Hau-Riege, S.P.
Thompson, C.V.
Hau-Riege, C.S.
Andleigh, V.K.
Chery, Y.
Troxel, D.
さらに 1 件
掲載資料名:
Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
612
発行年:
2001
開始ページ:
D2.2
出版情報:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995208 [155899520X]
言語:
英語
請求記号:
M23500/612
資料種別:
国際会議録

類似資料:

1 国際会議録 Experimental Studies Of The Reliability Of Interconnect Trees

Hau-Riege, S.P., Thompson, C.V.

Materials Research Society
7 国際会議録 The Effects of the Mechanical Properties of the Confinement Material on Electromigration in Metallic Interconnects

Hau-Riege, Stefan P., Thompson, Carl V.

Materials Research Society
2 国際会議録 The Effects Of The Mechanical Properties Of The Confinement Material On Electromigration In Metallic Interconnects

Hau-Riege, S.P., Thompson, C.V.

Materials Research Society
8 国際会議録 Reliability Issues for Submicron Interconnects and Vias

Thompson, C.V.

Electrochemical Society
3 国際会議録 The Effects Of Width Transitions On The Reliability Of Interconnects

Hau-Riege, C.S., Thompson, C.V., Narieb, T.N.

Materials Research Society
9 国際会議録 Interconnect Failure Mechanism Maps for Different Metallization Materials and Processes

Andleigh, V. K., Park, Y. J., Thompson, C. V.

MRS - Materials Research Society
4 国際会議録 Experimental Characterization Of The Reliability Of 3-Terminal Dual-Damascene Copper Interconnect Trees

Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K., Wei, F., Yu, B., Hau-Riege, S.P.

Materials Research Society
10 国際会議録 DFM viewpoints of cell-level layout assessments and indications for concurrent layout optimization

C.-M. Fu, P.-H. Yeh, Y.-K. Cheng, S. Klaver

Society of Photo-optical Instrumentation Engineers
5 国際会議録 Length Effects On The Reliability Of Dual-Damascene Cu Interconnects

Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., …

Materials Research Society
11 国際会議録 Grain Structure Statistics in As-Patterned and Annealed Interconnects

Fayad, W., Andleigh, V., Thompson, C. V., Frost, H. J.

MRS - Materials Research Society
6 国際会議録 Modelling of Grain Structure Evolution and its Impact on the Reliability of Al(Cu) Thin Film Interconnects

Riege, S. P., Andleigh, V., Thompson, C. V., Frost, H. J.

MRS - Materials Research Society
12 国際会議録 Failure analysis of wafer-level reliability testing failure

Oh,C.K., Neo,S.P., Bi,J.H., Wu,Z.M., Goh,L.C., Redkar,S.

SPIE - The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12