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Characterization of Slurry System and Suppression of Oxide Erosion in Aluminum CMP (Chemical-Mechanical Planarization)

著者名:
Devriendt, ft.
Grilaert, J.
Heylen, N.
Holl, K.
Meuris, M.
Yang, J.
Zhong, L.
さらに 2 件
掲載資料名:
Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
566
発行年:
2000
開始ページ:
115
終了ページ:
122
総ページ数:
8
出版情報:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558994737 [1558994734]
言語:
英語
請求記号:
M23500/566
資料種別:
国際会議録

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