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Modeling the Influence of Pad Bending on the Planarization Performance During CMP

著者名:
Devriendt, K.
Fyen, W.
Grillaert, J.
Heylen, N.
Heyns, M.
Meuris, M.
Vrancken, E.
さらに 2 件
掲載資料名:
Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
566
発行年:
2000
開始ページ:
45
終了ページ:
50
総ページ数:
6
出版情報:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558994737 [1558994734]
言語:
英語
請求記号:
M23500/566
資料種別:
国際会議録

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