A Study of the Planarity by STI CMP Erosion Modeling

A Study of the Planarity by STI CMP Erosion Modeling

著者名:

Chung, U. I.

掲載資料名:

Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

566

発行年:

2000

開始ページ:

33

終了ページ:

44

総ページ数:

12

出版情報:

Warrendale, PA: Materials Research Society

ISSN:

02729172

ISBN:

9781558994737 [1558994734]

言語:

英語

請求記号:

M23500/566

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014192
シリーズID:	PA00000011
会議名:	Symposium on chemical mechanical polishing
回次:	1999
会議開催地:	San Francisco, CA, USA
会議開催年:	1999.04.05-1999.04.07

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