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Multilevel Damascene Interconnection in Integration of MOCVD Cu and Low-K Fluorinated Amorphous Carbon

著者名:
Evans, D. R.
Hsu, S-T.
Nguyen, T.
Stecker, L. H.
Ulrich, B.
Yang, H.
さらに 1 件
掲載資料名:
Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
565
発行年:
1999
開始ページ:
129
終了ページ:
136
総ページ数:
8
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558994720 [1558994726]
言語:
英語
請求記号:
M23500/565
資料種別:
国際会議録

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