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4 A plated through-hole interconnect technology in Silicon

著者名:
掲載資料名:
Proceedings of the Second International Symposium on Electrochemical Microfabrication
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
1994-32
発行年:
1994
開始ページ:
45
終了ページ:
55
総ページ数:
11
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770910 [1566770912]
言語:
英語
請求記号:
E23400/950718
資料種別:
国際会議録

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