Blank Cover Image

Non-Contact Full Wafer Evaluation of Deep Levels in Silicon Via Temperature Dependent Surface Recombination Velocity, and Carrier Lifetime

著者名:
掲載資料名:
Proceedings of the Symposium on Contamination Control and Defect Reduction in Semiconductor Manufacturing II
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
1994-3
発行年:
1994
開始ページ:
1
終了ページ:
14
総ページ数:
14
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770651 [1566770653]
言語:
英語
請求記号:
E23400/941395
資料種別:
国際会議録

類似資料:

Buczkowski, A., Shimura, F., Rozgonyi, G.A.

Electrochemical Society

Agarwal, Aditya, Radzimaski, Z. J., Buczkowski, Z., Shimura, F., Rozgonyi, G. A.

Materials Research Society

Daio, H., Buczkowski, A., Shimura, F.

Electrochemical Society

Arndt, W., Graff, K., Heim, P.

Electrochemical Society

Buczkowski, Andrzej, Radzimski, Zbigniew J., Kirino, Yoshi, Shimura, Fumio, Rozgonyi, George A.

Materials Research Society

Rozgonyi, G.A.

Electrochemical Society

Buczkowski, A., Rozgonyi, G. A., Shimura, F.

Materials Research Society

G.Y. Chung, M.J. Loboda, M.F. MacMillan, J.W. Wan

Trans Tech Publications

L. Ling, L. Zhong, A. Buczkowski, Z.J. Radminski, T. Abe, F. Shimura

Electrochemical Society

Daio,H., Yakushiji,K., Buczkowski,A., Shimura,F.

Trans Tech Publications

Meynants, G., Poortmans, J., Mertens, R., Jones, S., Polce, N., Blackstone, S.

Electrochemical Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12