Stress Voiding and Electromigration Failure in Multilevel Interconnect Metallization
- 著者名:
- 掲載資料名:
- Proceedings of the fourth International Symposium on Ultra Large Scale Integration Science and Technology : ULSI science and technology/1993
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 1993-13
- 発行年:
- 1993
- 開始ページ:
- 220
- 終了ページ:
- 237
- 総ページ数:
- 18
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566770637 [1566770637]
- 言語:
- 英語
- 請求記号:
- E23400/932028
- 資料種別:
- 国際会議録
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6
国際会議録
Modelling of Failure Time Distributions for Interconnects Due to Stress Voiding and Electromigration
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