Further Investigation of Effects of pH on Silicon Dioxide Chemical Mechanical Polishing (CMP)
- 著者名:
- 掲載資料名:
- Chemical Mechanical Planarization : proceedings of the International Symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2003-21
- 発行年:
- 2003
- 開始ページ:
- 207
- 終了ページ:
- 214
- 総ページ数:
- 8
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774048 [1566774047]
- 言語:
- 英語
- 請求記号:
- E23400/200321
- 資料種別:
- 国際会議録
類似資料:
Electrochemical Society |
Materials Research Society |
Materials Research Society |
Materials Research Society |
Materials Research Society |
Materials Research Society |
Materials Research Society |
10
国際会議録
Evaluation of Commercialized Slurries and Pads for Polymer CMP (Chemical Mechanical Polishing)
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
6
国際会議録
Characterization of the Chemical Effects of Ceria Slurries for Chemical Mechanical Polishing
Materials Research Society |
Materials Research Society |