Determining the Effect of Slurry Flow Rate on the Tribological, Thermal and Removal Rate Attributes of Copper CMP

Determining the Effect of Slurry Flow Rate on the Tribological, Thermal and Removal Rate Attributes of Copper CMP

著者名:

掲載資料名:

Chemical Mechanical Planarization : proceedings of the International Symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2003-21

発行年:

2003

開始ページ:

104

終了ページ:

113

総ページ数:

10

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774048 [1566774047]

言語:

英語

請求記号:

E23400/200321

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014084
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
回次:	6th ; 204th
会議開催地:	Orlando, FL, USA
会議開催年:	2003.10.12-2003.10.17

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