Copper Chemical Mechanical Planarization Processes in Carbon Dioxide

Copper Chemical Mechanical Planarization Processes in Carbon Dioxide

著者名:

掲載資料名:

Chemical Mechanical Planarization : proceedings of the International Symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2003-21

発行年:

2003

開始ページ:

76

終了ページ:

82

総ページ数:

7

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774048 [1566774047]

言語:

英語

請求記号:

E23400/200321

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014084
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
回次:	6th ; 204th
会議開催地:	Orlando, FL, USA
会議開催年:	2003.10.12-2003.10.17

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1 国際会議録 Copper Chemical Mechanical Planarization Processes in Carbon Dioxide Denison, G.M., Visintin, P.M., DeSimone, J.M., Bessel, C. Electrochemical Society	7 国際会議録 Electrochemical Characterization of Copper in Ammonia-containing Slurries for Chemical Mechanical Planarization of Interconnects Sainio, C., Duquette, D.J. Electrochemical Society
2 国際会議録 Hydrodynamics of a Chemical-Mechanical Planarization Process Moudgil, B., Park, C-W., Singh, R., Sohn, I. S. Materials Research Society	8 国際会議録 Electrochemical Interactions during the Chemical Mechanical Planarization of Copper in Ammonia Based Slurries Sainio, C.A., Duquette, D.J. Electrochemical Society
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6 国際会議録 The Carbon Dioxide Technology Platform DeSimone J. M. Society of Plastics Engineers	12 国際会議録 Planarization of Copper Damascene Interconnects by Spin-Etch Process: A Chemical Approach Mukherjee, S.P., Levert, J.A., DeBear, D.S. Materials Research Society

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