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Mechanical Delamination for the Materials Integration

著者名:
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2003-19
発行年:
2003
開始ページ:
359
終了ページ:
367
総ページ数:
9
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774024 [1566774020]
言語:
英語
請求記号:
E23400/200319
資料種別:
国際会議録

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