Blank Cover Image

Characterization of Bonded Interface by HF Etching Method

著者名:
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2003-19
発行年:
2003
開始ページ:
70
終了ページ:
75
総ページ数:
6
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774024 [1566774020]
言語:
英語
請求記号:
E23400/200319
資料種別:
国際会議録

類似資料:

1 国際会議録 Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO2

Suni, T., Henttinen, K., Suni, I., Maekinen, J.

Electrochemical Society
7 国際会議録 Electrochemistry of Ta in Aqueous HF

I. Suni

Electrochemical Society
2 国際会議録 Fabrication of InP/SiO2/Si Substrate using Ion-Cuffing Process and Selective Chemical Etching

P. Chen, D. Xu, L. Mawst, K. Henttinen, T. Suni, I. Suni, T. Kuech, S. Lau

Electrochemical Society
8 国際会議録 Fabrication and Characterization of IC Compatible Through-Wafer Polysilicon Interconnects

I. Luusua, K. Henttinen, P. Pekko, T. Vehmas

Electrochemical Society
3 国際会議録 Mechanical Delamination for the Materials Integration

Henttinen, K., Suni, T., Nurmela, A., Kulawski, M., Suni, I.

Electrochemical Society
9 国際会議録 Interface Strength Characterization of Bonded Wafers

Petzold, M., Petersilge, M., Abe, T., Reiche, M.

Electrochemical Society
4 国際会議録 SOI Wafers with Buried Cavities

Suni, T., Henttinen, K., Dekker, J., Luoto, H., Kulawski, M., Makinen, J., Mutikainen, R.

Electrochemical Society
10 国際会議録 Characterization of bulk-micromachined direct-bonded silicon nanofilters

Tu,J.K., Huen,T., Szema,R., Ferrari,M.

SPIE-The International Society for Optical Engineering
5 国際会議録 Wafer Scale Packaging of MEMS by Using Plasma Activated Wafer Bonding

Suni, T., Henttinen, K., Lipsainen, A., Dekker, J., Luoto, H., Kulawski, M.

Electrochemical Society
11 国際会議録 Optical interconnect on printed wiring board

Karppinen, M., Maekinen, J.-T., Kataja, K., Tanskanen, A., Alajoki, T., Karioja, P., Immonen, M., Kivilahti, J.

SPIE - The International Society of Optical Engineering
6 国際会議録 Direct Bonding of Thick Film Polysilicon to Glass Substrates

Luoto, H., Suni, T., Henttinen, K., Kulawski, M.

Electrochemical Society
12 国際会議録 OPTIMIZATION OF ETCHING UNIFORMITY AND REPEATABILITY IN DILUTED HF

Bellandi, E., Alessandri, M., Tonti, A., Pipia, F., Wolke, K., Schenkl, M., Geomini, M., Kwakman, L.F.T.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12