Fabrication of Sub-micron Active Layer SSOI Substrates using Ion Splitting And Wafer Bonding Technologies

Fabrication of Sub-micron Active Layer SSOI Substrates using Ion Splitting And Wafer Bonding Technologies

著者名:

Ruddell, F.

掲載資料名:

Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2003-19

発行年:

2003

開始ページ:

25

終了ページ:

30

総ページ数:

6

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774024 [1566774020]

言語:

英語

請求記号:

E23400/200319

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014082
シリーズID:	PA00000028
会議名:	International Symposium on Semiconductor Wafer Bonding ; Electrochemical Society Meeting
回次:	7th ; 2003
会議開催地:	Paris, France
会議開催年:	2003.04.27-2003.05.02

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