Electrochemical Planarization of Copper

Electrochemical Planarization of Copper

著者名:

掲載資料名:

Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2003-13

発行年:

2003

開始ページ:

244

終了ページ:

255

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773935 [1566773938]

言語:

英語

請求記号:

E23400/200313

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014077
シリーズID:	PA00000028
会議名:	International Symposium on Thin Film Materials, Processes, and Reliability ; Meeting of the Electrochemical Society
回次:	2003 ; 203rd
会議開催地:	Paris, France
会議開催年:	2003.04.27-2003.05.02

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