Selectivity Studies on Tantalum Barrier Layer for Copper Chemical Mechanical Planarization
- 著者名:
- 掲載資料名:
- Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2003-13
- 発行年:
- 2003
- 開始ページ:
- 164
- 終了ページ:
- 173
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566773935 [1566773938]
- 言語:
- 英語
- 請求記号:
- E23400/200313
- 資料種別:
- 国際会議録
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