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Nanostructured Ta-Si-N Thin Films as Diffusion Barriers between Cu and SiO2

著者名:
掲載資料名:
Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2003-13
発行年:
2003
開始ページ:
154
終了ページ:
163
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773935 [1566773938]
言語:
英語
請求記号:
E23400/200313
資料種別:
国際会議録

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