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Plasma Charging Damages for Gate Oxide and Hot-Carrier Degradation and Electro-migration Properties in Cu Interconnects

著者名:
So, D.S.
Wang, J.J.
Yang, C.T.
Chen, D.H
Theng, H.C.
Chen, H.
Lee, S.Y.
さらに 2 件
掲載資料名:
Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2002-22
発行年:
2002
開始ページ:
310
終了ページ:
315
総ページ数:
6
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773799 [1566773792]
言語:
英語
請求記号:
E23400/200222
資料種別:
国際会議録

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