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Mechanisms of Copper Removal during Chemical Mechanical Polishing

著者名:
掲載資料名:
Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2002-22
発行年:
2002
開始ページ:
235
終了ページ:
245
総ページ数:
11
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773799 [1566773792]
言語:
英語
請求記号:
E23400/200222
資料種別:
国際会議録

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