Multi-scale Simulations of Copper Electrodeposition onto a Resistive Substrate

Multi-scale Simulations of Copper Electrodeposition onto a Resistive Substrate

著者名:

掲載資料名:

Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2002-22

発行年:

2002

開始ページ:

30

終了ページ:

45

総ページ数:

16

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773799 [1566773792]

言語:

英語

請求記号:

E23400/200222

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014055
シリーズID:	PA00000028
会議名:	International Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics ; Meeting of the Electrochemical Society
回次:	2002 ; 202nd
会議開催地:	Salt Lake City, UT, USA
会議開催年:	2002.10.20-2002.10.24

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