Chemical Mechanical Polishing for Copper in Hydrogen Peroxide-based Slurries

Chemical Mechanical Polishing for Copper in Hydrogen Peroxide-based Slurries

著者名:

掲載資料名:

Chemical Mechanical Planarization : proceedings of the International Symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2002-1

発行年:

2002

開始ページ:

246

終了ページ:

256

総ページ数:

11

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773294 [1566773296]

言語:

英語

請求記号:

E23400/2002-1

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014034
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
回次:	5th ; 201st
会議開催地:	Philadelphia, PA, USA
会議開催年:	2002.05.12-2002.05.17

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